Peter said:
Hi,
This comes in mid-2006 and AIUI requires that lead content is below
0.1%.
Surely, one could achieve this by making the overall product heavier?
Or does it work on a per-circuit-board basis? In that case, the lead
in standard solder will probably weigh more than 0.1% of the weight of
the populated PCB....
This could be a serious problem for any company that is slowly running
down a stock of old chips. These won't be lead-free, and neither will
be any chips purchased from the many used chip vendors who pass on
surplus stock. I expect a lot of their business will dry up since many
companies are requiring *zero* lead content on *all* components.
Any views?
http://europa.eu.int/eur-lex/pri/en/oj/dat/2003/l_037/l_03720030213en00190023.pdf
|3. This Directive does not apply to spare parts for the repair,
|or to the reuse, of electrical and electronic equipment put on
|the market before 1 July 2006.
So that would seem to cover stocks of old chips. IC manufacturers
are going to need to be lead-free after July 2006, for Euro sales, but
'put on the market' would seem to cover anything made/invoiced
prior to that ?
and there are more exemptions here :
|(11) Exemptions from the substitution requirement should be
|permitted if substitution is not possible from the scientific
|and technical point of view or if the negative environmental
|or health impacts caused by substitution are
|likely to outweigh the human and environmental benefits
|of the substitution. Substitution of the hazardous
|substances in electrical and electronic equipment should
|also be carried out in a way so as to be compatible with
|the health and safety of users of electrical and electronic
|equipment (EEE).
|7. — Lead in high melting temperature type solders (i.e. tin-lead
|solder alloys containing more than 85 % lead),
|— lead in solders for servers, storage and storage array systems
|(exemption granted until 2010),
|— lead in solders for network infrastructure equipment for switching,
|signalling, transmission as well as network
|management for telecommunication,
|— lead in electronic ceramic parts (e.g. piezoelectronic devices).
The target is mainly the high volume/short life/disposable consumer
products, (rightly so).
It seems other large industry groups have lobbied for exemptions...
-jg