"
It is easier to place most of the manufactuing process in a vacuum and
eliminate the dust particles. {Hint: dust cannot float in a vacuum to
land on the wafers, but drops like a rock to the floor.}
"
According to my physics class in high school a perfect vacuum cannot be
created and there will always be some air left over...
Concerning issue's with damage to chips by vaporization:
1. First create a vacuum.
2. Then convert any floating(?)/remaining dust particles to energy.
3. Then place wafers inside it and start vacuuming.
Alternatively plan:
Slowly turn dust into energy to prevent nuclear explosion
Another crazy idea would be to use water and produce the chip in water...
Somehow purifieing water and maybe water better than air ? But I doubt it
I just had another idea:
1. First create a vacuum as good as possible.
2. Then highly charge the surroundings of the vacuum with static
electricity.
Hopefully this will attract all remaining floating dust particles.
3. Perhaps keep it like that... and start producing the chip.
4. Otherwise if the static charge is to be disabled, first vaporize the dust
particles on the side or wipe them off ?!?
Bye,
Skybuck.
