Jim said:
Jim Thompson wrote:
[snip]
The only relatively constant term would be gate capacitance, ESD and
MOS body diode capacitances will be all over the place with
temperature.
...Jim Thompson
One other thing (that you would know well) is that the gate capacitance of
the MOS devices will depend strongly on the bias (VGS) so it is important
to measure the calibration channel and the measurement channel with the
same DC bias and about the same signal amplitude on the switch pins.
Chris
Nope. I've modeled that situation very carefully. Once a channel is
induced, the gate _capacitance_ is essentially a constant, only the
series resistance varies which, of course, can screw you up royally if
you aren't aware of it.
Now that I have it characterized I've been using gate capacitance as
bypass capacitors extensively.
...Jim Thompson
Right, mos devices are nice dense decoupling capacitors, but they are also
used as the varactors in RF VCOs because the capacitance from gate to
source and drain is much greater when the channel is formed than the
capacitance when the channel is not formed. What I was suggesting is that
if the drain/source terminals are very close to the positive supply voltage
then the NMOS device will be on and the PMOS device will be off, whereas
when the source & drain pins are near the negative rail, then the PMOS
device will be on and the NMOS device will be off. Because the PMOS device
has probably the same oxide thickness but at least double the width of the
NMOS device, I would expect that the capacitance would be substantially
more when the PMOS device is on than when only the NMOS device is on, and
highest of all when both devices are on. Another thing that I have not yet
considered is that many analog switch ICs selectively drive the backgate
from either the supply rail or the S/D terminals (and hence have lousy
charge injection). Depending on how they do this, all sorts of odd things
might happen, which you would be in a better position to comment on I
expect.
Chris