Of course it would. Silver filled epoxy is still mostly epoxy, and
doesn't conduct heat very well. Even diamond filled epoxy doesn't
conduct heat very well.
It certainly would conduct better between two "flat surfaces" that are
not as flat as an idiot like you thinks they are.
It is only for the fine gaps, idiot. Both faces are essentially flat,
better rarely ever to the degree they would need to be for a dopey ****
like you to even be able to see the miniscule difference. You know...
like OPTICAL quality flatness AND polish.
Another surface quality 'thing' you are unaware of. The main body of
the block would be directly interfaced, even if it was a mere, cheap
extrusion without surface finishing.
Even when one thinks one has two flat faces, one should *still* apply
gap filler media, even if it is only for fine scratches and gap
management.
If silver filled epoxy was so bad ALL the chip makers would be using
something else to attach their dies to the chip base with. They are not.
They ALL use silver filled epoxy, and nearly all use the same one I have
and use. EpoTek.
You are about as dumb as it gets. You would probably think that a
simple two screw attachment would perform better.
