S
Spehro Pefhany
Would it be an optionto machine off the sn/pb and Nickel, then
replate?
Cheer
Yup. Possible. I expect the pins are something like Kovar, can find
out.
Best regards,
Spehro Pefhany
Would it be an optionto machine off the sn/pb and Nickel, then
replate?
Cheer
dependsin why you need to but, how about putting the parts in machined
gold plated sockets and solder from top inside only?
-Lasse
They are embedded in ceramic insulation and I want to use them as plug
pins. They've been soldered to, so they're "ruined".
Best regards,
Spehro Pefhany
DoN. Nichols said:For just a few, without a solder cup for wire ends, I would grip
them in a solder-free area with needle nose pliers or the like, dip
in
rosin flux and then in a solder pot to get it up to the melting
point,
and then strike the hinge part of the pliers against a wood block,
thus
flicking off *most* of the solder (but not all).
With solder cups, what I would do is grip it in some kind of pin
vise, and then heat with a soldering iron and either use a vacuum
solder
removal iron or use small braid soaked in rosin flux to wick up as
much
solder as possible.
DoN.
As an electronic lab tech I second all of that. If the assembly is too
large or delicate to knock off the liquid solder, wiping it with a
wadded-up dry paper towel works well too.
If you hold the pin vertical and heat it from the bottom with an iron,
most of the solder will flow down onto the hot tip. Hit the pin with a
vacuum solder sucker as you pull the iron away. The tip of the sucker
will recoil into the pin when the plunger springs back so whatever
supports the work should be fairly substantial.
jsw
Spehro Pefhany said:On Tue, 23 Jul 2013 08:48:49 -0400, "Jim Wilkins"
I can get the pins relatively clean pretty easily. The goal is to
have
nice shiny gold plated pins again, like new, so they can be used as
contact surfaces.
Right now I'm thinking mechanical abrasion to get down to the bare
metal (which is relatively hard) then nickel plate, then gold plate.
http://www.electrochem.org/dl/ma/203/pdfs/2374.pdf
Solder dissolves gold plating quickly.
http://www.eng-tips.com/viewthread.cfm?qid=7370
jsw
Of course, there is that approach. Dip the pins first into a pot of
molten gold to dissolve the Pb/Sn, then in another pot of clean molten
gold to re-plate. You'd need a nitrogen atmosphere, I think, so you're
already 80% there, and the pots of gold can be supplied by leprechauns.
Sláinte
They are embedded in ceramic insulation and I want to use them as plug
pins. They've been soldered to, so they're "ruined".
How, and still be able to remove the solder?
Is that your best Polish joke? ;-)
Jon Elson said:Or, melt the entire pin off the connector. The melting point of
pure gold is over 1000 C! That is REALLY hot. White hot, and you
can't be near it without singing the hair off your arms, using
dark goggles, etc.
But, a small pot of gold would probably be worth several thousand
$ at the very least. One Troy ounce is a tiny little bead.
If you think all that is fun, read this and the comments to continueAlthough, HCl and H2SO4 are astonishingly slow when it comes to nickel.
The stuff is pretty much noble (hence its popularity!).
Acidity alone doesn't determine corrosivity: if a complex is formed, metal
will dissolve much faster. Copper dissolves faster in HCl + H2O2 than
H2SO4 + H2O2, because it forms a green chloride complex (there is also a
reduced form with a deep brown color, which is probably familiar to anyone
who's used this brew to etch PCBs), while sulfuric basically does nothing
special with copper.
Hydrofluoric acid isn't actually very strong, but because it forms a
complex with silicon (hexafluorosilicate), it's one of the few chemicals
which dissolves glass.
Oxidation potential is, of course, a big force. Electrolysis can beat the
pants off any chemical, for obvious reasons. (There's literally nothing
more "acidic" on Earth than the LHC -- one definition of acidity is
"proton donator", and a naked proton beam at ~light speed can't really be
stopped from "donating" to anything!) Among chemicals, this means zinc
dissolves faster than iron faster than nickel, while copper pretty much
doesn't at all (in acidic water alone). If you add an oxidizer (nitric
acid, H2O2, hypochlorite, etc.), less energy is spent generating hydrogen
and more doing the reaction. (Bubbling decreases or stops when an
oxidizer is used, unless another gas is produced -- nitric usually gives
off NO and NO2 fumes, nasty things.)
There is, of course, no chemical which is a stronger oxidizer than
fluorine, which will literally burn through anything on the periodic table
besides pure oxygen and the noble gasses (which, except for helium and
neon, are all known to form compounds with fluorine anyway, they just take
some persuading).
Tim
amdx said:If you think all that is fun, read this and the comments to
continue the fun.
"How Not to Do It: Tertiary Butyllithium"
If you think all that is fun, read this and the comments to continue
the fun.
"How Not to Do It: Tertiary Butyllithium"
Oxidation potential is, of course, a big force. Electrolysis can beat the
pants off any chemical, for obvious reasons. (There's literally nothing
more "acidic" on Earth than the LHC -- one definition of acidity is
"proton donator", and a naked proton beam at ~light speed can't really be
stopped from "donating" to anything!)
I'd be interested to know how you finally solve this.