I picked up a nearby scrap plasma TV for a few bucks with a pink and green pixelated screen.
I found the graphics processor, added a little flux around its edges and heated it up in a circular motion with my hot air gun......and voila' , it fixed the problem,
but I realize this is likely just a temporary fix. (I don't have a reflow station to do a proper fix.)
The backside of the board is loaded with tiny smd components directly behind the chip. How is a proper removal/reflow of a bga chip accomplished without the other components falling off from the bottom?
Is it just the surface tension that holds the component in place once the solder melts, or is the temp applied to the bottom is just under the melting point?
Idk if I'm up to the challenge of doing a proper fix on it due to my lack of experience and equipment. I'm just curious how its done with components on the backside.
Thanks and Happy holidays.
I found the graphics processor, added a little flux around its edges and heated it up in a circular motion with my hot air gun......and voila' , it fixed the problem,
but I realize this is likely just a temporary fix. (I don't have a reflow station to do a proper fix.)
The backside of the board is loaded with tiny smd components directly behind the chip. How is a proper removal/reflow of a bga chip accomplished without the other components falling off from the bottom?
Is it just the surface tension that holds the component in place once the solder melts, or is the temp applied to the bottom is just under the melting point?
Idk if I'm up to the challenge of doing a proper fix on it due to my lack of experience and equipment. I'm just curious how its done with components on the backside.
Thanks and Happy holidays.