M
Mike Noone
Hi - In the near future it looks like I'm going to be needing to make a
couple boards that have BGA components. I've worked hard to avoid BGA
for a long time now - but it looks like I just can't escape it any
longer.
I have found that at my school (I am a senior EE student) there is a
reflow oven that I can use. I spoke with the guy in charge of it and
and he has fairly minimal experience with BGA, though others have used
the oven for that purpose. What do I need to know? First of all - what
should the footprint look like? One of the parts I may be using is the
Analog ADXRS401
(http://www.analog.com/en/prod/0,2877,ADXRS401,00.html)
It does not give a recommended footprint, unfortunately. I'm assuming I
should just use round pads centered beneath each ball? How large should
they be? If I want a via connected to a ball - can I put it on the pad
itself, or does it need to be away from the pads?
Now - once I have my board made - how do I solder it? The guy I spoke
with said that I should add some solder paste to the part. Does this
make sense? I had always thought that the ball of solder was enough,
though he said the paste would help make sure the part does not move as
it is going through the reflow machine. If I do need to use paste -
Would I need to use a stencil for this, or could I just dab small drops
of solder paste on each pad?
Thanks,
-Mike
couple boards that have BGA components. I've worked hard to avoid BGA
for a long time now - but it looks like I just can't escape it any
longer.
I have found that at my school (I am a senior EE student) there is a
reflow oven that I can use. I spoke with the guy in charge of it and
and he has fairly minimal experience with BGA, though others have used
the oven for that purpose. What do I need to know? First of all - what
should the footprint look like? One of the parts I may be using is the
Analog ADXRS401
(http://www.analog.com/en/prod/0,2877,ADXRS401,00.html)
It does not give a recommended footprint, unfortunately. I'm assuming I
should just use round pads centered beneath each ball? How large should
they be? If I want a via connected to a ball - can I put it on the pad
itself, or does it need to be away from the pads?
Now - once I have my board made - how do I solder it? The guy I spoke
with said that I should add some solder paste to the part. Does this
make sense? I had always thought that the ball of solder was enough,
though he said the paste would help make sure the part does not move as
it is going through the reflow machine. If I do need to use paste -
Would I need to use a stencil for this, or could I just dab small drops
of solder paste on each pad?
Thanks,
-Mike