G
Ge0rge Marutz
Can anyone recommend a good tech note explaining the merits of keeping
ground plane under a micro? Perhaps this article could demonstrate
examples of good and bad design. How much copper is enough? Where do
you need it, what does it have to cover? Does it need to be continuous
or can a trace run through it, etc.
For those of you who care why I ask (warning, I get wordy)...
I have an embedded design based on a 4 layer board. It has a single
micro clocked with a internal RC oscillator running at 1MHZ, 4 analog,
and 4 digital I/O. I've stuck with what I know to be proper and
recommeded design practices.
Top copper layer
http://img402.imageshack.us/my.php?image=topcopper7pl.jpg
Ground plane
http://img402.imageshack.us/my.php?image=groundplane9yl.jpg
This board has passed EMC test by a large margin when tested under
SAE J1113, GM, Volvo, and Ford standards.
I have a new customer who, for some unknown reason, is critical of my
design. His only problem with it is the fact that there is not a
continuous copper ground fill under the micro in the top layer of the
board. Traces and vias under the part break it up.
I tried to ensure him that this was acceptable by providing evidence
that the design has passed a number of manufactures EMC requirements,
is manufacturable, and has shown zero failures with over 60,000
products in the field. This is not good enough for him. He says
unless I can come up with a good reason why my grounding strategy will
work for him, I will have to redesign the board to meet his request.
He does not care, or understand, that I have a full ground plane
immediately underneath the top layer.
I can't for the life of me get my point accross. What makes it even
more difficult is that he admittedly knows very little about
electronics himself. So, I can't talk him through this. He is a high
level manager with a background in mechanical engineering. Someone
within his organization told him that my design would not work and he
believed them. They offered no explaination why they were concerned or
exactly what they were looking for.
By no means an I saying my design is perfect. I am a humble person
just trying to do the best I can. However, his concerns appear to be
unjustified. This is frustrating. I can't just change the board to
make him happy. There are a number of reasons why this can't happen.
Mostly due to timeline. We want to launch the product in two months.
I can't make all the necessary changes, build protoypes, and go through
a full EMC test in that timeframe.
Any words of advice? I would be deeply appreciative.
Ge0rge
ground plane under a micro? Perhaps this article could demonstrate
examples of good and bad design. How much copper is enough? Where do
you need it, what does it have to cover? Does it need to be continuous
or can a trace run through it, etc.
For those of you who care why I ask (warning, I get wordy)...
I have an embedded design based on a 4 layer board. It has a single
micro clocked with a internal RC oscillator running at 1MHZ, 4 analog,
and 4 digital I/O. I've stuck with what I know to be proper and
recommeded design practices.
Top copper layer
http://img402.imageshack.us/my.php?image=topcopper7pl.jpg
Ground plane
http://img402.imageshack.us/my.php?image=groundplane9yl.jpg
This board has passed EMC test by a large margin when tested under
SAE J1113, GM, Volvo, and Ford standards.
I have a new customer who, for some unknown reason, is critical of my
design. His only problem with it is the fact that there is not a
continuous copper ground fill under the micro in the top layer of the
board. Traces and vias under the part break it up.
I tried to ensure him that this was acceptable by providing evidence
that the design has passed a number of manufactures EMC requirements,
is manufacturable, and has shown zero failures with over 60,000
products in the field. This is not good enough for him. He says
unless I can come up with a good reason why my grounding strategy will
work for him, I will have to redesign the board to meet his request.
He does not care, or understand, that I have a full ground plane
immediately underneath the top layer.
I can't for the life of me get my point accross. What makes it even
more difficult is that he admittedly knows very little about
electronics himself. So, I can't talk him through this. He is a high
level manager with a background in mechanical engineering. Someone
within his organization told him that my design would not work and he
believed them. They offered no explaination why they were concerned or
exactly what they were looking for.
By no means an I saying my design is perfect. I am a humble person
just trying to do the best I can. However, his concerns appear to be
unjustified. This is frustrating. I can't just change the board to
make him happy. There are a number of reasons why this can't happen.
Mostly due to timeline. We want to launch the product in two months.
I can't make all the necessary changes, build protoypes, and go through
a full EMC test in that timeframe.
Any words of advice? I would be deeply appreciative.
Ge0rge