HELP: Cutting Open a CPU to Reveal Die

[Doctor Dave]

Hi,

I'm doing some research on materials forming and would like to
replicate the surface of a CPU die on the nm level. Does anyone have
any experience on removing the packaging on modern CPUs to reveal the
die?

Alternatively, does anyone know of 65 or 90 nm dies that are not
packaged?

Best wishes, dave

 

[PeteS]

A great number of newer devices come in 'FlipChip' packages, where the
'lid' of the chip is immediately above the die - this is done for
effective thermal transfer to heat sinks - these are easy to dissect -
pop the heat sink off for many of them, and the die os there for you to
see.

Cheers

PeteS

 

[Michael Black]

A great number of newer devices come in 'FlipChip' packages, where the
'lid' of the chip is immediately above the die - this is done for
effective thermal transfer to heat sinks - these are easy to dissect -
pop the heat sink off for many of them, and the die os there for you to
see.

Cheers

PeteS

And I'm sure many have learned this the hard way.

Michael

 

[CWatters]

Hi,

I'm doing some research on materials forming and would like to
replicate the surface of a CPU die on the nm level. Does anyone have
any experience on removing the packaging on modern CPUs to reveal the
die?

If you want to expose the die in a particular chip there are ways of
disolving the plastic so that the die is left intact. I saw it done about 15
years ago. It's expensive to have it done but try:..

http://siliconcert.com/reliability_news/r_news_fourteen.htm

If you don't care about which chip it is find one in a ceramic LCC package
and unsolder the lid eg..

http://www.amkor.com/Products/all_products/LLCC.cfm

 

[Doctor Dave]

Thanks everyone - very helpful. Will post a result if something
interesting turns out.