With a full plane you can live with a few sprinkled 0.1uF plus on 10uF
or so. Because the plane itself is a small and very good distributed
capacitor.
I know I'm 'preaching to the choir' but the plane is a capacitor at
low enough frequency. Higher frequencies it's actually more like a
transmission line whose characteristic impedance starts out as a
function of plane separation [that's why thinner is better, because
this Zo is THE limiting factor] It's like transmission lines in 3D, in
parallel, so difficult to envision. At high frequency there's not much
area involved so the capacitance is low, then at lower frequency as
the wave spreads, there is more area and there is more capaictance.
Think like a transmission line whose Zo drops as the wave spreads,
kind of like Zo(f) When f is high, Zo goes to some value, then when f
is low, the Zo is dropping like a rock 10 ohm, 1 ohm, 0.1 ohm etc
depending on size of the board. The trick with caps is to place them
judiciously so that the board planes 'look' like they continue out to
infinity.
From reading your posts, I thinkyou know this stuff already. Has
anybody calculated the Zo(f) for PCB planes?
If you can get a copy of the AppNote from Ansoft describing using
their HFSS to reduce number of bypass caps it's worth reading. Going
from something like 60 caps down to 12 and placing them properly [may
have misremembered] substantially IMPROVED the performance of the PCB
by reducing noise on the planes.