W
Winfield Hill
Winfield Hill wrote...
Oops, a phrase ended up in the wrong place! Corrected paragraph:
... 200A in a 120N25 will result in a Vds = 8V drop, substantially
more than the 4V drop for a set of the lower-cost IGBTs I suggested.
This results in more dissipation than the IGBTs see. But the two
parts do not handle pulses the same, due to die size. The 120N25's
single-pulse Transient Thermal Resistance curve, fig 12, gives us a
nice low 0.06C/W number for a 15ms pulse (note: the 120N25 has a much
larger die than the 4pc50), so 200A * 8V = 1600W. In the end we get
a more reasonable Tj rise of 96C. You may well be able to parallel
three 120N25 FETs for single 600A 15ms pulses and keep their junction
temp rise under control. But four FETs would be much safer, given
the FET's current sharing won't be perfect.
----
One more point: the above calculations are for conducting dissipation
losses only, and do not include switching losses or dissipation. On
the other hand, the conduction dissipation is overstated because the
current during the entire 15ms pulse duration.
These simple calculations are in the back-of-the-envelope category.
Which, as we say in H&H's AoE, is not to be taken lightly.
A single IGBT transistor from their even more popular (and cheaper)
MG200 parts may work well. A bit higher drop, but still very good.
Thanks,
- Win
whill_at_picovolt-dot-com
Let's examine the rather-brief IXYS datasheet. A novice engineer
might take the 120N25's 20-milli-ohm Rds(on) spec at face value,
but at high currents (and the resulting high junction temperatures
during a pulse) it'll be nearly 2x higher for 200A and Tj = 100C,
as shown by figures 4 and 5, or more like 40 milli-ohms. Therefore
200A in a 120N25 will result in a Vds = 8V drop, substantially more
voltage than 4V for a set of the lower-cost IGBTs I suggested. The
single-pulse Transient Thermal Resistance curve, fig 12, gives us
a nice low 0.06C/W for 15ms (the 120N25 has a much larger die than
the 4pc50), so that 200A * 8V = 1600W. This is more dissipation
than the IGBTs see, yet we still get a reasonable Tj rise of 96C.
So you might be able to parallel three 120N25 FETs for single 600A
15ms pulses and keep their junction temp rise under control. But
four FETs would be much safer, given the FET's current sharing
won't be perfect.
Oops, a phrase ended up in the wrong place! Corrected paragraph:
... 200A in a 120N25 will result in a Vds = 8V drop, substantially
more than the 4V drop for a set of the lower-cost IGBTs I suggested.
This results in more dissipation than the IGBTs see. But the two
parts do not handle pulses the same, due to die size. The 120N25's
single-pulse Transient Thermal Resistance curve, fig 12, gives us a
nice low 0.06C/W number for a 15ms pulse (note: the 120N25 has a much
larger die than the 4pc50), so 200A * 8V = 1600W. In the end we get
a more reasonable Tj rise of 96C. You may well be able to parallel
three 120N25 FETs for single 600A 15ms pulses and keep their junction
temp rise under control. But four FETs would be much safer, given
the FET's current sharing won't be perfect.
----
One more point: the above calculations are for conducting dissipation
losses only, and do not include switching losses or dissipation. On
the other hand, the conduction dissipation is overstated because the
current during the entire 15ms pulse duration.
These simple calculations are in the back-of-the-envelope category.
Which, as we say in H&H's AoE, is not to be taken lightly.
Toshiba's popular MG300 or MG400 modules drop about 3.5V at 600A.
A single IGBT transistor from their even more popular (and cheaper)
MG200 parts may work well. A bit higher drop, but still very good.
Thanks,
- Win
whill_at_picovolt-dot-com