Mark said:
I am manufacturing a small run of devices which I would like to
protect from duplication. They consist of a 50x50mm PCB in a hand-held
plastic case with batteries. I plan to partition the case and pour in
a self-curing potting agent
Dedicated two-part potting epoxy is relatively expensive. Can anyone
suggest a few hardware variety alternatives, in order of preference?
Thank you,
Mark Hansen
Mark:
First off let me comment that potting a PC board is not an effective
duplication deterrent. One company that I worked for potted some of
their products to seal the circuits for environmental protection.
However whenever there was a field failure the potting would be taken
off the PC board to see what had happened to the device !! So potting
would be somewhat of a bother to the cloner of your product but would
not prevent the copy process.
Secondly please be aware that there are some things to consider when
potting a circuit board. Here is a list of some key areas of
consideration.
1) Some cheap hardware store type epoxy products have fillers in them
that may render the potting conductive. I am aware of both steel and
aluminum filled types.
2) Epoxy products of some types and surface mounted components may not
always be the best mix. The differences in thermal characteristics
between FR4 PC boards and the potting can break small surface mount
component solder connections.
3) There are plenty of epoxy products designed specifcally for
electronics potting so you should not have too much problem finding a
product to use. I would check out some electronics products retailers
such as Newark or McMaster Carr.
4) Partitioning the area to get potted can be very difficult to
implement effectively. In order to make potting practical and have the
material be pourable means that the epoxy is somewhat viscous and it
will run through the smallest hole or crack. If it is the battery area
that you want to leave open then I would pot with a 9V battery harness
protruding above the epoxy surface. In the case of batteries like AA or
AAA then there are some nylon battery holders that you could use to
hold the cells and isolate the area from epoxy fill-in.
5) Even with item 4 above said there can be problems getting complete
fill of the areas under circuit boards if not enough space is left
between the edges of the PC board and the case that it is in. I have
seen the need to angle off the corner(s) of the PC board or provide a
hole through the center of the PC board to allow the epoxy to flow past
and under the board.
6) Two part epoxy can often generate some heat as a result of the
curing process. In addition sometimes ovens are used to hasten the cure
of the epoxy to speed up the manufacturing process. If your PC board
has some sensitive low level analog type circuits it is possible that
the curing heat can cause detrimental shifts in the circuit performance
or destroy any pre-potting calibrations than may have been done.
7) There are some silicon based potting materials available for potting
that have some advantages for surface mounted components.
It is finally my opinion that there are better ways of protecting a
design than potting that are less bothersome than potting. One very
good way is to capture a large part of the product design and
intellectual property into the firmware of a microcontroller on the
product PC board. Select a microcontroller that has a good locking
protection system and you will be much farther toward protecting your
ideas from prying eyes. Even the protections offered by "fuse"
protected FLASH based microcontrollers can be sometimes overcome by
persistent hackers if the product cloner is willing to spend enough
money. So the best way for you to overcome that consideration is to
stay ahead of the cloner by offering changes to the product every so
often that make your product look more attractive to the customer than
an older less capable clone.
Good luck
- mkaras