@(*steve*) , really appreciate you sharing crucial gotchas. i think these are your 2 main gotchas, both related to SMD's:
A UV box or laser cutter seems superior to messing around with magazine pages and a laminator or clothes iron. No?
- Chemical Etching: undercutting.
- Caused by over-etching, correct?
- Fixed by sponge method, plus maybe drawing traces slightly thin. No?
- Milling: Ripping the copper.
- Caused by warped or non-level board-surface, correct?
- "the problem with V-bits is that you need pcb surface to be extremely flat" reply #11
- Question: Is non-level surface caused by non-level platform, or varying thickness of the PCB?
- Warping fixed by bolting the board down on all sides to a non-warpable platform. No?
- Uneven surface fixed by bolting the board down on all sides to a level platform, plus software compensation. No?
- Further helped by use of tear-resistant bit, such as this one.
- "Optimized for trace isolation and copper rubout on printed circuit boards. 15° taper angle minimizes cut width variation due to poor substrate flatness"
- Caused by warped or non-level board-surface, correct?
Paint? Your comment below sounds like you mean laser-cutting the copper, not milling the paint. Confused.Yes, but the control, whilst sufficient for most normal tasks is not fine enough for ablating paint.
"a lower powered laser cutter with more software control could do the isolation milling..."
check out PreciseBits link above.I imagine you could use a tool with parallel cutting edges, but you couldn't do fine lines then (and it would be far too easy to snap)
Ok, so you're agreeing we can reduce undercutting by not sponging the already-etched areas. Correct?The areas already etched
Yep, as mentioned in my OP, "most inkjet methods i've seen are too fiddly, finicky, and/or sloppy)."Have you considered toner transfer?
A UV box or laser cutter seems superior to messing around with magazine pages and a laminator or clothes iron. No?
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