It combines with the surface oxide and excludes atmospheric oxygen
from making more oxide.
This allows the liquid metal (solder) to contact solid metal without
oxides being between them, which would inhibit their forming a thin
intermetalic layer that connects them together.
Cleans the base metal(s) of the joint, both physically (floats crud
away) and chemically (eats various things that would keep the solder
form sticking), and prevents post-cleaning formation of an oxide layer
that would keep the solder from sticking.
Cleans the base metal(s) of the joint, both physically (floats crud
away) and chemically (eats various things that would keep the solder
form sticking), and prevents post-cleaning formation of an oxide layer
that would keep the solder from sticking.
IME, it has a tendency to warm parts through faster so you have to apply
the soldering iron for less time to make a joint. It seems I sometimes
get better joints when I use flux. (I'm not doing PC boards here, it's
soldering wires to model railroad rail.)
It's also useful for "recharging" desoldering braid.
IME, it has a tendency to warm parts through faster so you have to apply
the soldering iron for less time to make a joint. It seems I sometimes
get better joints when I use flux. (I'm not doing PC boards here, it's
soldering wires to model railroad rail.)
It's also useful for "recharging" desoldering braid.