Biggest source of glitches is inadequately by-passed power supply rails. Each time a high-speed logic device changes its output state, a current pulse occurs at the power supply input to the device. This pulse can then propagate as a "glitch" over the power supply rails to other devices. The solution is to always bypass the power pin on EACH device with a capacitor, typically 0.1 μF stacked ceramic type, connected as close to the device as physically possible between the power supply rail and the common rail. Back when logic ICs were sold in DIP packages, you could purchase sockets with this capacitor built into the socket. Good PCB layout is also important, especially when using the faster logic families with clocks approaching one gigahertz. Having power and signals on different layers of the PCB is virtually mandatory.
Glitches in a production circuit design are an indication of either poor engineering or defective components. I would suspect both, given the current explosion of products originating from the Pacific Rim nations, and the fact that a new generation of engineers needs to re-learn techniques from the previous century while discovering new techniques apropos to the technology of this century. As things get smaller and faster the problem of "glitches" and how to eliminate them becomes much more difficult to solve. And the test equipment you need to even "see" a pico-second "glitch" is very expensive. <sigh> Sorta glad I am retired and will avoid such trials and tribulations.