GregS said:
Definately tin the board.. I mostly use a very thin solder of 63/37 leaded
solder.
greg
I always tin the board first, then wick the excess back off until the pads
are really smooth. I then 'tack' one end or one pin of the device to the
board using just heat from the iron and the tinning on the component pin and
pad. I then examine the positioning really closely with the magnification.
If I am happy that the component is located exactly correctly, I will hold
it in place with the tip of a scalpel, and tack solder another pin and then
re-examine the positioning. If all is still well, then I go ahead and solder
it in fully.
A liquid flux is absolutely essential for the soldering process as it
assists the solder to flow by capilliary action between the pins and pads
much more readily, which helps really significantly with not getting
inter-pin shorts with fine pin-pitch sm components. Very fine gauge 'angel
hair' solder is also a must. The flux that I use comes in an aerosol can,
and is made by Electrolube and is their product SMFL 200. It is very cheap,
and very very effective.
Of course, all this assumes that you are talking 'conventional' hand
soldering. The best way is to use paste solder and hot air, but I don't
think that you are talking that level of professional at this point ?? It is
all down to practice and confidence to get good results, and is really not
that difficult if you use a fine tipped iron with enough heat, and are
reasonably skilled at normal size soldering. If you do get shorts between IC
pins, don't worry about them at the time. Just note where they are, and
carry on. Go back to them at the end with a good quality wick placed against
the vertical face of the pin, and reheat. the excess solder will readily
come out from between the pins, without compromising the joint. Before your
final examination under magnification, clean up with a flux remover. For
this I use a Servisol aerosol product. You will be amazed at how good a job
you can do with a little practice.
Arfa