Brad said:
Hi,
I have a bunch of circuit boards (no SMDs) that I would love
to find an easy way to remove the parts without unsoldering each
one at a time. I know there is a chemical (not cheap), when
applied, lowers the melting point of solder. Maybe I could use
a hot air gun? Do you know a good method?
Thanks in advance, Brad
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I've used this technique for salvaging and repair for 10 years.
Although I do own a proper vacuum assist desolder station I
prefer to use a hot-air gun - it causes less damage to tracks etc
De-soldering ICs etc
Use a hot-air paint-stripper,1400W,500 degree centigrade,with 2 level heat
control to prolong element life. Activity may appear fearsome but it is no
worse than a flow-solder bath.Pre-heat for one minute then apply to
pcb,make
extractor tool to pull ic from component side. Make an IC extractor from an
old large pair,10 inch, of
circlip pliers,the jaws need to open out enough to clip around the ends of
up to 64 pin
ICs with enough force to overcome the mechanical force of the situation
where all
the pins are angled relative to the PCB holes.Forge around both of the
original circlip
pins,one joggle at right angle to clear the heigth of the ICs and a slight
inwards joggle
to make purchase on the underside of the IC,grinding a wedge angle to the
points
helps particularly where there is no clearance between IC and pcb.
Use this technique for salvaging (working order) up to 64 pin ics ( when
practised ),other
components, sm and even repair (tracks are not dislodged).For repair work
beware of
spatter of molten solder causing solder bridges on adjascent compoents
because if you
are doing the job properly,ie not dislodging pcb tracks the IC must be
pulled out with
some force and the board tends to flex so possibility of flicking solder.
The secret is to be as quick as possible,idealy the body of the extracted ic
will
be just about handleable rather than too hot to touch.Try practising on a
board
with close packed TTL chips or similar and aim for an extraction rate of
something like one every 2 seconds.Between boards keep the hot air gun
running on
low power setting (not switching off).Don't rest the gun against the board
when heating
as vibration seems to affect the element life also don't allow the board to
flex back onto the gun for the same reason.Hold the gun so airflow is angled
to the board
as solder spat directly into the nozzle can kill the element.
About the only components that cannot be removed with this technique are
parts
moulded in soft plastic,e.g. crystal sockets,rf coils with plastic former
(IF coils usually OK)
some DIP switches. Even these are desolderable intact if the body of the
component is previously
cooled with a blast of aerosol freezer spray.
SAFETY NOTE:- ensure good ventilation, use safety goggles because trapped
water etc in the capaillary structure of glass fibre reinfiorced PCB can
super-
heat to steam and jet out molten solder,also it is possible to overlook
small
electrolytic capacitors on the solder side of the board which of coarse
explode
with the direct heat of the hot air gun and beware of very
slight risk of combustion of adjascent flammable parts especially where
components have extra (un-noticed) mechanical bonding leading to extended
duration of heating activity.
other tips on
http://homepages.tcp.co.uk/~diverse