OK, here is a very quick and dirty photo of 2 tests of the board cut at low power. The notes give you speed (mm/s) and %power.
Sorry about the low quality this was done in poor lighting with the board resting on my knees and taken with a mobile phone!
You can get some idea of scale by looking at the size of the text. The figures denote the text size in mm.
If you look closely you'll notice that what appear to be lines may be 2 closely spaced lines.
The grid of circles are of slightly varying size and are at 2.54mm spacing between their centres. To the right of that is an SO-8, below that is 8 pads for a 1206 device that contains 4 bussed resistors. To the direct right of that is an 0402 set of pads.
The three thinks that look like flowers are a footprint for a small BGA package.
The 9 things around these three BGA footprints are something like meshed forks. Again these are done at different pad widths. In all cases but one the width of the conductor is the same as the gap between the conductors. Because I'm using a zero offset for my cut, the conductors shrink.
Around the outside is a thin track which does some zig-zaging around to see if there is any difference between horizontal and vertical, and also diagonal cutting. These actually highlight the limitations of the repeatability of this laser cutter. In some areas you can clearly see a relative shift. This may be caused by backlash in the Y direction of the laser cutter I was using. My guess is that the shift is as large as 1/2 the kerf (so about 1/16mm. This may also be exacerbated by the fact that the drawing was originally converted to HPGL which has a 0.025mm resolution (1/40mm) before being converted to a DXF for the laser cutter.
Near the bottom right corner there are a series of triangles. These are 10mm long, are 1mm at the widest and 0mm at the line. This will be a fairly sensitive test of the total effect of the laser's kerf and the undercutting during etching.
Another factor that was suggested to me yesterday was that I had only allowed about 6 hours for the paint to dry. In my earlier tests the paint had been left for several days. This is likely to affect adhesion of the paint, and also probably it's tolerance to water (given that it is a water based paint).
I am going to (as I think I have mentioned) retry this with an unused section of the board (that will have had a week to cure) at a power similar to what has been used here, but with a second pass.
It is quite interesting to see the difference between the board cut at 250mm/s and the one cut at 100mm/s. The fact that there is a difference is remarkable because both boards took exactly 3 minutes and 6 seconds to cut.
The triangles suggest to me that the kerf is a little more than 1/8 of a mm. Previous tests with other materials (to get a friction fit) gave me a figure of 0.13mm, so it's in the same ballpark.
Yeah, I'm a casual member, so it costs me $10 for a night plus 10c per minute of laser time (min charge $1). So it's pretty cheap. For 8 of these, I used just over 20 minutes of laser time. (it was 6 minutes for another method.) Oh well, may as well show you that too!
Again, sorry about the really crap photo.
It's pretty hard to make out stuff, but where it's in focus you can see how it performs. You can also see the effect of the speed at which the laser can be turned on and off. This is a test where horizontal and vertical differ significantly.
The notes are speed/power/scan interval, and the presence of the same errors in alignment again are pretty suggestive of this being an issue with the plot file rather than than laser cutter.
I hope some of this is interesting.
Oh, one more thing. There was a guy on one of the crowd funding sites building a small laser cutter for this purpose. I'll try to find the link. He was using a very low power (comparatively) laser (only a couple of watts?)
OK, this is not the one I was thinking about, but here you go:
https://www.kickstarter.com/project...ice-a-mini-arduino-laser-cutter-and-eng/posts