.
Sir Paul Ramsbottom . . . . . . .
I am placing on some initial Marked Up references to be consulting , but you query:
All the values were with respect to earth, but pins 11 and 18 don't seem to be earth referenced so maybe the value there is ok.
So my very first question / action would be for you to confirm . . . . .
We can see that on J2 connector that using an OHMMETER in lowest . . .ohms. . . range should be revealing that pins 5 thru 8 should be interconnected.
Reaching over to measure pin 16 and pin 20 should also reveal a like interconnecting .
NOW . . .we figure out the grounding question . . . . by initially noting that the +12 VDC analog supply as well as the MINUS 5,2 VDC supply are using an isolated T3 transformer for their power derivation.
The derived voltage from CR26 plus C40 and C41 is generating a straight forward supply with only a slight
variant in the respect of using Q13 / BUZ71A series power FET as a series switch in delivering a slight delayed timing of full powering up of that supply..
Lets revert back to the ohmming function and doubly verify that the C42 final filter cap of that +12 VDC analog
supply supply is having its NEGATIVE lead making a connection to our earlier cluster of grounds.
If so, then we should expect that the other MINUS 5,2 Analog supply should also be tied into that common buss.
BUT here is its difference, it is using CR27 plus companion filter capacitors C15 and C16 for power derivation
and has the created NEGATIVE voltage flowing on down from C15 and C16 to the next C? filter (get that number for us) and finally down to the last C50 filter.
So you now want to test the POSITIVE connection of that C50 filter to see if it also is grounded to all of all of our other grounds.
If so, that clears up all of the ground interconnect verifications.
The only variant now is the design of that last negative 5,2 Analog supply, if normal, the cathode of the CR27 and the shared interconnects to the POSITIVE leads of C15 and C16 would go straight to ground.
Not so in this design, as they are wanting a current sample of this supply and are using series inserted R43
( 5 watts, no less . . .babycakes ! )as a current sampler, with its shunt voltage take off fed to the base emitter junction of Q11 and then feed back to the control board thru Q11' s emitter.
That was the first slight disruption of supply flow, getting to ground , with the next one being the Drain -Source
disruption at Q14 /BUZ71A series power FET, which is dependant upon gate drive from the control board at P3-12 for making that final ground connection of this circuit loop.
I really think that this supply drop is associated with the fault at the pin 17of the supply +12 VDC Display source supply voltage , being now reduced to 1.5 VDC and the
MAIN fault, is with the +15,5 at pin 19 of J2 now only being 1 VDC.
I think that a voltage or current sensing fault from a supply level has been detected and fed to the control board and it has activated the gate of the A2 SCR and thereby crow barred that supply.
Most suspect would be a long time related decline in capacitance of filters.
I forget if you have capacitance reading equipment or ESR evaluative capabilities.
Also I think that your voltages might be stable with no loading placed upon the unit, less our major 2 supply voltages and the minor decline of 5,3 to 3,5 VDC on the last one.
On the bottom schematic you can see 3 BLUE ARRROWED mark up routes that can avalanche their respective zeners and feed gate drive thru R11 to activate A2 crowbar shutdown.
Its imperative that the YELLOW marked cap C29? has not had signifiant overall capacitance decline or its
reduced time constant will make that leg of circuitry hypersensitive / erroneous.
Same situation over at C28, associated with a clean stable reference supply for the LM339 comparators .
The GREEN ARROWS mark ups are related to the other voltage lines and current samples that are fed into that A2 SCR gate circuitry via the Q7 transistors C-E junction.
Can you supply R11 and R42 resistive values.
I am most suspicious of the four orange electrolytics in the unit.
Are your power semiconductors, that are being heatsinked, still having silicone wetted unions/bonds to the
heat sinks . . .OR . . . has the moist / wet silicone element, long since migrated laterally, and left the devices
sitting high and dry on a thermally isolated, bone dry layer of tin oxide ?
Will continue on TS procedure . . . after your info fill ins.
TECHNO ASSEMBLY REFERENCING . . . . . # 1
TECHNO SCHEMA REFERENCING . . . . . # 2
73's de Edd
.