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Best orientation for the Scythe Zipang on ASUS A8N32-SLI ?

S

Skybuck Flying

Hello,

Which orientation is best for the Scythe Zipang CPU Cooler onto the ASUS
A8N32-SLI motherboard ?

Apperently the zipang can have 4 different orientations.

When looking top down onto the motherboard I see 4 things which could get
extra cooling/airflow from the zipang:

1. At the top there is a silver heatsink.
2. At the left there is a copper heatsink.
3. At the bottom there is a copper heatsink with asus logo on it.
4. At the right there are the memory modules.

Here are two pictures with number 1,2,3,4 on it:

Zoomed in picture:

http://members.home.nl/hbthouppermans/Question/Zoom.JPG

Zoomed out picture with zipang on case:

http://members.home.nl/hbthouppermans/Question/Question.JPG

Which number should receive extra cooling ?

In other words which one runs hottests ?

Bye,
Skybuck.
 
S

Skybuck Flying

Yeah,

Here is how the zipang probably works best:

First let's look at the large heatsink array on the top of it.

Top-down view:

* = fan blade.
_ = heatsink fin.
< = airflow from/to case fans.
O = end of heat pipes.

O O O O O O
<<< _**___________*___________* <<<<
<<< ___**_________*_________**_ <<<<
<<< _____**_______*_______**___ <<<<
<<< _______**_____*_____**_____ <<<<
<<< _________+_________+_______ <<<<
<<< ___________________________ <<<<
<<< *********______CPU__******* <<<<
<<< ___________________________ <<<<
<<< _________+_________+_______ <<<<
<<< _______**_____*_____**_____ <<<<
<<< _____**_______*_______**___ <<<<
<<< ___**_________*_________**_ <<<<
<<< _**___________*___________* <<<<

It probably works best when the cold air from the case inlet fans can flow
between the fins... so the fins should be place horizontally... so the air
can go between them...
otherwise the air will be blocked... since those large fins are solid on the
sides... they have no holes.

Now the zipang has something interesting at the bottom.

There is a little extra heatsink at the bottom near the cpu:

Which looks like the air could go in all directions... but the largest gaps
are vertical so the exact opposite of the large heatsink fins... this could
be nice for the top exhaust fan which might then be able to suck hot air
that came down from the fins/blades and out of the heat sink to the exit...

So it looks like this:

<<<^^^^^^^^^^^<<<
<<<^^^^^^^^^^^<<<
<<<^^^^^^^^^^^<<<
<<<+++++++++++<<<
<<<+++++++++++<<<
<<<+++++++++++<<<
<<<+++++++++++<<<
<<<+++++++++++<<<
^^^^^^^^^^^

There are more gaps/airflow pathways vertical/upwards then horizontal/side
ways.

So these gaps could allow to suck hot air away from the north bridge as
well...

Maybe just a little bit.

The heat pipes are up in the air with lots of room around them so those
heatpipes might loose some heat too.

I am little bit worried about those little heat pipes near number 3. Since I
think that's the north bridge chip which might get hot...

However I looked at how the passive heatsink design of the motherboard
works.

It mentions the heat is transported to number 2. Which I think could be the
mosfet ?

There is a little copper heatsink there.... which now receives the most
airflow from the cpu cooler.

So number 2 is going to be ultra cool (?) ;)

Which leaves number 3 to worry about a little bit...

But there are already two inlet fans blowing against number 3... so it will
probably get a little bit of airflow from those two inlet case fans... there
is also an inlet case fan on the bottom.. So it looks ok I hope... there are
also less components there...

There are more components near 1 and 2...

Ok, I am gonna go with the x-bit labs setup... placing the fins horizontal
seems best anyway... so not much choice I guess... that's good.

So the only thing left to look at is what would happen if it was flipped...
then the memory chips would get extra cooling but that would probably be
bad... because this would below the heat back down... I looked at the memory
chips and how they work... there heatpipes are upwards away from the
motherboard... so there the heat must go up or so.

I am not worried about the memory chips ;)

Well this was interesting to look at it...

If I didn't take a closer look then I might have placed it wrongly ?

Well fingers crossed... it probably doesn't matter much..

I just want a long lasting motherboard.

Later.

My Dream PC will probably be back up again next week or so because I
probably need a special 4 to 4 pin extension atx power cable.

I'll try to connect everything anyway and see how far I get... maybe the
cable can make it after all if I route it past the pci clips ;)

And ofcourse nice pictures will follow STAY TUNED ! ;) =D

Wonder Wonder Wonder Wonder, me in Wonder LAND ;) :)

Bye,
Skybuck.
 
S

Skybuck Flying

Hmm now I am not so sure anymore.

GMAN says to place it flipped.

So the heatsinkfins are still horizontal... but the big heatpipes are at the
top near the 200 mm suckhole. (it's not a blow hole lol)

That kinda makes sense... those heatpipes probably get quite hot... and
could loose some heat thanks to the big suckhole.

The mosfet is pretty much covered by the two outlet case fans I guess...

This flipped setup would blow cool air over the memory chips.

Which could be nice as long as the chips don't overheat or so..

I am not sure what the effect would be...

Would it blow hot air in ?

Or would it blow cool air in ?

Would it sufficate the memory chips ?

Hmmm.

Well I have serious doubts.

I can see adventages and disadventages of both setups.

Maybe it doesn't matter much or maybe it does I don't know.

But the horizontal fin layout is probably the most important decision...

I got that one covered.

Wow though decision...

Bye,
Skybuck.
 
S

Skybuck Flying

Not sure about orientation.

Horizontal heatpipes might be better after all... better airflow through
little heatsink etc...

Sick.

Bye,
Skybuck.
 
S

Skybuck Flying

There are some factors to consider:

1. Heat goes up.

2. Gravity.

3. Water/heat flow inside the heatpipes.

4. Airflow.

5. Final case orientation.

So a new factor to consider.

If the heat pipes are vertical so that they point towards the sky... this
means the heatpipes are then up... so the heat travels through the complete
large heat sink array.

This could explain why x-bit labs saw 2 degree cooler when the heatsinks
where pointing towards the sky.

The largest heatpipe goes through the whole heatsink/fins array.

So maybe it would be smart to start at the bottom and then go up... so the
whole heatsink gets to dissipate the heat.

In this orientation the mosfet would get some draw draft as well.

The memory chips would be completely free which is nice.

The silver heatsink gets some extra down draft as well since there is a
small gap near that part of the fan.

Finally the largest heatpipe is near the north bridge which is a bit
worrieing... it might dissipate heat there... but then again it's directly
in the airflow stream...

So any heat disspitated there will probably go out the rear back case fan...

The heatsink fins are also horizontal so the case airflow can blow between
that as well towards the rear case fan.

Only problem is... no, too little airflow on the little heatsink... at the
bottom.

Though call.

I have requested some advice on the scythe forum.

I really wonder how this beast was designed... maybe some engineer will
reply... I doubt it though... they probably busy...

Meanwhile I can read up on heatsink theory ;)

Anyway somebody else mentioned... if the heatpipes are horizontal that might
be bad... because then there might be gas inside the heatpipes...

Also how the **** is the heat gonna travel through the heatpipes if they are
horizontal ?

Doesn't make much sense... unless these belgiums somehow screwed their test
maybe ?

Or maybe it's because of airflow blowinst past the heatpipes a little bit.

Hmm I think those belgiums and other people testing outside the case are
probably **** ups.

Oh well.

Difficult difficult difficult.

Bye,
Skybuck.
 
P

peter

This was not a discussion...if you are unable to follow Pictorial Directions
have some grade 6'er explain it to you
and in the future have someone build all of your systems...

I never answer your "self talks" but just this once I thought I would be
nice.....after all the answer was in Picture form..
but no more...I see now that you are incapable of learning whether it be
Computer Part Installation or proper use of a help section like this.
You only post to hear yourself talk or to raise some inane subject that
common sense would have solved in a minute and a half.
peter
 
S

Skybuck Flying

I like to know what I am doing and how it works before I follow pictures.

Besides the text and the pictures on x-bit labs could have been better, it's
not super-mega-terribly-clear but ok ;)

I am think I am gonna go with the x-bit labs setup after all.

It makes the most sense according to the heatpipe theory ;)

Also it looks like if the little pins are like the up-right position or so
;)

Oh well.

Bye,
Skybuck.
 
M

mpm

I like to know what I am doing and how it works before I follow pictures.


I don't know what you need pictures for?
If there's any "Expert" on hot air & wind around here, it's you!!
 
S

Skybuck Flying

Well some support dude from the Scythe forum said to place it so heatpipes
are horizontal... he also said to experiment since it depends on some
factors.

But he didn't explain anything so I guess he just guessing as well a little
bit or so.

I can see a little benefit of placing it horizontal.

The heatsink fins will allow the heat to travel upwards through the fins...

Otherwise the heat from the heatsinks might build up in the vertical
position and get stuck behind the fins.

Hmm..

I guess I might have to do some experimentation after all.

Fortunately the socket 939 mounting system should be easily to put on and
off ;)

Bye,
Skybuck.
 
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